XKx-2LH-WZ

2L全场景迷你机箱

2L 210*55*200mm 2*2.5inch SSD Front I/O 2*USB Type-A 1*Earphone, 1*Mic

  • Technical specifications
  • Product Introduction
  • Technical Download
    • Nome do Produto: XKx-2LH-WZ
    • 产品定位: 2L全场景迷你机箱
    • 新尺寸: 2L
    • Intel移动平台: ADL/RPL/RPL Refresh-U/P/H,ADL-N/TWL-N
    • Intel台式机平台: H610/B660/Q670/B760 + RPL/ADL-S
    • AMD移动平台: Picasso-U/Dali,CEZ/LCN/BCL/RNR-U/H,Stoney Ridge
    • AMD台式机平台: A300 + AM5,X300/A300 + AM4
    • 兆芯: KX-6000G,KX-6000,KX-7000
    • 龙芯: LS3A5000,LS3A6000
    • 列表数据: Mini ITX Case 210*55*200mm ≤65W ABS + SGCC

    2L 210*55*200mm 2*2.5inch SSD Front I/O 2*USB Type-A 1*Earphone, 1*Mic

    Motherboard

    Thin Mini-ITX / Mini-ITX

    CPU / Chipset

    Intel : ADL-N | JSL | GLK | Elkhart Lake ADL-U/P/H | RPL-U/P/H | TGL-UP3/H35 | TGL-H45 | ICL-U | CML-U | CFL-U | ADL-S/RPL-S+H610/Q670/B660

    AMD : RMB-U/H | RNR-U/H | CZN-U/H | LCN-U | BCL-U | Dali | PCO|StoneyRidge| AM4+X300/A300| AM5+A300

    Zhaoxin : KX-6000G | KX-6000 | KX-7000

    Loongson : LS3A5000 | LS3A6000

    CPU TDP
    ≤65W

     

    Memory
    2*SO-DIMM or Onboard

     

    Storage

    1*M.2 SSD (PCIe/SATA)

    2*2.5inch SSD

     

    Wireless

    M.2 2230 PCIe/ USB/ CNVi (Wifi+BT)

     

    Material
    ABS + SGCC

     

    Dimension
    210*55*200mm

     

    Rear I/O

    Rear IO decide by MB

    4*USB Type-A+1*RJ45 or 1*Type-C+3*USB Type-A+1*RJ45 or 2*USB Type-A+2*RJ45

    1* HDMI

    1*Earphone+1*Mic

    1* VGA/ DP/ COM (decide by MB)

     

    Front I/O

    2*USB Type-A

    1*Earphone

    1*Mic

     

  • 16:10屏镁合金超轻超薄商务本16:10屏镁合金超轻超薄商务本

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