XB70-H02/ H03-BY

1L Intel vPro高性能miniPC


Features: ·Intel vPro ·UMA 65W or 45W CPU+30W dGPU ·2*SODIMM + 3*M.2 2280 SSD ·Toolless detached/ Padlock/ DDR&SSD Door ·8*USB-A + 1*Type-C, ≥3*display Scenarios: ·Financial, Office mini PC, Mini host controller, AI Training, etc


  • Technical specifications
  • Product Introduction
  • Technical Download
    • Nome do Produto: XB70-H02/ H03-BY
    • 产品定位: 1L Intel vPro高性能miniPC
    • 新Intel: MTL/ARL-H,ADL/RPL-U/P/H,ADL-N/TWL,ADL/RPL-S+H610/B660/Q670
    • AMD: FP6, CEZ/LCN/BCL/RNR-H
    • 列表数据: Mini Office PC/ HTPC 75W 1L/ 178*176.2*38.9mm Metal chassis + Plastic panel M.2 2230 wifi module 2*DDR4/DDR5 SO-DIMM 3*M.2 2280 SSD

    Features: ·Intel vPro ·UMA 65W or 45W CPU+30W dGPU ·2*SODIMM + 3*M.2 2280 SSD ·Toolless detached/ Padlock/ DDR&SSD Door ·8*USB-A + 1*Type-C, ≥3*display Scenarios: ·Financial, Office mini PC, Mini host controller, AI Training, etc

    Platform

    Intel ARL/MTL-H | RPL/ADL-H | ADL-N/TWL | RPL/ARL-S + H610/B660/Q670

    AMD FP6 CZN/LCN/BCL/RNR

     

    Thermal
    75W

     

    Memory

    2*DDR4/DDR5 SO-DIMM

     

    Storage

    3*M.2 2280 SSD

    WiFiBT

    M.2 2230 Wifi Module

    Supported OS
    Windows 11/Linux

     

    Dimensions
    178*176.2*38.9mm

     

    Material
    Metal chassis + Plastic panel

     

    I/O Ports

    8*USB-A

    1*Type-C

    1*HDMI-Out

    1*DP

    1*DC Jack

    1*Audio Jack

    1*RJ45

    1*Power Button + 1*Reset Hole

    1*HHHL DGPU card or IO1+IO2

    VESA
    Supported

     

     

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