XS22V3-H3

XS22V3-H3 is a general-purpose 2U2S product based on the Intel Eaglestream platform, offering a cost-effective solution for the mainstream market through modular combinations and a cost-optimized design.

  • Technical specifications
  • Product Introduction
  • Technical Download
    • Nome do Produto: XS22V3-H3
    • 产品定位: EGS 2S2U General Server
    • 产品序号: Server
    • 平台: Intel
    • 类型: 通用
    • 规格: 2U
    • 列表数据: Server

    XS22V3-H3 is a general-purpose 2U2S product based on the Intel Eaglestream platform, offering a cost-effective solution for the mainstream market through modular combinations and a cost-optimized design.

    Product Code XS22V3-H3
    Processor 1 or 2x Intel® 4th & 5th Gen Xeon® Sapphire Rapids/ Emerald Rapids, up to 225W
    Chipset Intel C741
    Memory 16x DDR5 slots, 8 channel per CPU
    Storage

    Front: Up to 12x 3.5" HDD or 24x 2.5" drives

    Rear: Up to 4x 3.5" HDD or 4x 2.5" drives

    Internal: Up to 2x M.2 SSDs (SATA/Nvme)

    PCIe Expansion

    Up to 10x standard PCIe slots and 1x OCP3.0 slot

    Up to 4x DW GPU or 8x SW GPU

    Network

    1x 1GbE IPMI RJ45

    2x 1GbE RJ45 for internet

    1x OCP3.0, 4x 1GbE / 2x 10Gb SFP+ / 4x 10Gb SFP+/ 2x 25Gb SFP28 option

    I/O Ports

    Front：2x USB3.0, 1x VGA, 1x Power button，1x UID

    Rear：2x 1GbE RJ45 for internet，1x 1GbE IPMI RJ45，2x USB3.0, 1x VGA, 1x Console Port Over RJ45

    Management AST2600, 2 xRJ45 GbE management port
    Power 2x Standard CRSP Power Modules，1+1 redundancy
    Fan

    4x hot-swap Fans, N+1 redundancy

    Cold plate optional

    Dimension

    2U standard rack server

    W 447mm x H 86mm x D 840mm

    Environment Operating temperature：5ºC - 35ºC , Up to 45℃ for typical config
    Product Code XS22V3-H3

  • Features

     

    High Scalability

    Up to 16x 3.5" HDDs;

    Up to 28x 2.5" or E3.S SSDs;

    Up to 10x standard PCIe slots and 1x OCP 3.0 slot;

    Up to 4x DW GPU or 8x SW GPU.

     

    Reliable Performance

    225W CPU and 16DIMM DDR5 memory meet the mainstream application requirements;

    Expand the memory capacity with CXL technology; Optimized thermal design.

     

    Cost Efficiency Design

    Extreme motherboard layers and plates design;

    Onboard 1GbE network.

     

     

     

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